Product ID Document Name Status ANSI DoD
IPC-2251
Design Guidelines for Electronic Packaging Utilizing High Speed
Techniques
Not yet published
IPC-2252
Design and Manufacturing Guide for RF/Microwave Circuit
Boards
Orig. Pub.
IPC/JPCA-2315
Design Guide for High Density Interconnects (HDI) and Microvia Orig. 06/00
IPC-2401
Not yet published
IPC-2431
Not yet published
IPC-2511
Generic Requirements for Implementation of Product
Manufacturing Description Data and Transfer Methodology
Rev A 01/00
IPC-2512A
Sectional Requirements for Implementation of Administrative
Methods for Manufacturing Data Description
Rev A 11/00
IPC-2513
Rev A 11/00
IPC-2514
Sectional Requirements for Implementation of Printed Board
Manufacturing Data Description
Rev A 11/00
IPC-2515
Sectional Requirements for Implementation of Bare Board Product
Electrical Testing Data Description
Rev A 11/00
IPC-2516
Sectional Requirements for Implementation of Assembled Board
Product Manufacturing Data Description
Rev A 11/00
IPC-2517
Sectional Requirements for Implementation of Assembly In-Circuit
Testing Data Description – 2-11gChair, Bob Neal, Agilent
Technologies
Rev A 11/00
IPC-2518
Sectional Requirements for Implementation of Part List Product
Data Description - Chair, Harry Parkinson, Parkinson Consulting
Rev A 11/00
IPC-2524
PWB Fabrication Data Quality Rating System Orig. 02/99
IPC-2531
Standard Recipe File Format Specification
IPC-2541
Generic Requirements for Electronic Manufacturing Shop Floor
Equipment Communication
Not yet published
IPC-2546
Sectional Requirements for Shop Floor Electronic Assembly
Equipment Communication
Not yet published
IPC-2547
Sectional Requirements for Shop Floor Electronic Inspection and
Test Equipment Communication
Not yet published
IPC-2571
Generic Requirements for Electronic Manufacturing Supply Chain
Communication-Product Data Exchange (PDX)
Not yet published
IPC-2576
Sectional Requirements for Electronics Manufacturing Supply
Chain Communication of As-Built Product Data - Product
Exchange (PDX)
Not yet published
IPC-2577
Sectional Requirements for Supply Chain Communications of
Manufacturing Quality Assessment -- Product Data Exchange
(PDX)
Not yet published
IPC-2578
Sectional Requirements for Supply Chain Communication of Bill of
material and Product Design Configuration Data-Product Data
Exchange (PDX)
Not yet published
IPC-2615
Printed Board Dimensions and Tolerances SupersedesIPC-D-300
Orig. 06/00
IPC-3406
Guidelines for Electrically Conductive Surface Mount Adhesives Orig. 7/96
IPC-3408
General Requirements for Anistropically Conductive Adhesive
Films
Orig. 11/96
IPC-4101
Specification for Base Materials for Rigid and Multilayer Boards Supersedes IPC-L-108, IPC-L-109,
IPC-L-112, IPC-L-115
Orig. 12/97
IPC-4103
Specification for Plastic Substrates, Clad or Unclad, for High
Speed/High Frequency Interconnection
Not yet published
IPC-4104 - Specification for High Density Interconnect (HDI) and Microvia
Materials
Orig. 5/99
IPC-4110
Specification and Characterization Methods for Nonwoven
Cellulose Based Paper for Printed Boards
Orig. 8/98
IPC-4121
Guidelines for Selecting Core Constructions for Multilayer Printed
Wiring Board Applications
Supersedes IPC-CC-110A
Orig. 1/00
IPC-4130
Specification and Characterization Methods for Nonwoven "E"
Glass Mat
Orig. 9/98
(100 paginas)
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